EQS-News
SUSS MicroTec presents hybrid bonding all-rounder XBC300 Gen2 D2W/W2W
- XBC300 Gen2 D2W/W2W: Versatile hybrid bonding platform
- Up to 40% space saving compared to stand-alone bonders
- Key technology for 3D integration and boosting chip performance
EQS-News: SÜSS MicroTec SE / Key word(s): Product Launch
Thanks to its versatility, different hybrid bonding processes can be developed and qualified in parallel, making the XBC300 Gen2 D2W/W2W perfectly tailored to the needs of research facilities and development departments of semiconductor manufacturers. Compared to stand-alone W2W or D2W hybrid bonders, the XBC300 Gen2 D2W/W2W requires up to 40 percent less space. It is therefore a particularly efficient and footprint-optimized solution for testing hybrid bonding methods and preparing them for high-volume production. "Semiconductor manufacturers have to evaluate individually for each application which hybrid bonding technology leads to better process results. With our innovative solution, we provide them with a single tool to evaluate the best bonding process in each case. Our new solution is therefore the optimal flexible platform for the subsequent commissioning of independent W2W or D2W hybrid bonders with high throughput for large volumes," says Markus Ruff, Head of Product Line Bonder at SUSS MicroTec. Diskutieren Sie über die enthaltenen Werte |