Taiwan Semiconductor (TSMC) - größter EMS-Player der Welt (Seite 24)

[Raoul777]

Hallo zusammen,

hat jemand Erfahrung mit TSM ?
Würde gerne Wissen wann die Dividendenauszahlung ist.
Und auch sonstige Informationen über das Unternehmen würden mich interessieren.
VG

[R-BgO]

TSMC shifts to 8-inch processing to produce fingerprint sensors for next-generation iPhone
Josephine Lien and Mavis Hong, Taipei; Jessie Shen, DIGITIMES [Tuesday 11 February 2014]


Taiwan Semiconductor Manufacturing Company (TSMC) will use its 8-inch processing, instead of 12-inch, to produce fingerprint sensors for Apple's next-generation iPhone due to concerns about yield rates for 12-inch wafer-level packaging (WLP), according to industry sources.

Apple previously decided to have TSMC produce fingerprint sensors for its next-generation iPhone at the foundry's 12-inch facilities using a 65nm process, the sources noted. However, acknowledging risks associated with 12-inch WLP technologies, Apple has finally chosen TSMC's 8-inch processing which enables mature yield rates for WLP to produce the fingerprint sensors, the sources said.

As TSMC shifts back to 8-inch processing to fabricate fingerprint sensors for the next-generation iPhone as done previously, the foundry will continue to subcontract the packaging process to backend houses, the sources indicated. Xintec and China WLCSP are identified as the backend partners.

According to Apple's previous decision, which was to have TSMC fabricate the new fingerprint sensors at its 12-inch fabs, TSMC would handle the backend wafer-level chip-scale packaging (WL-CSP) process in-house, the sources pointed out.

Yield rates for 8-inch WLP are able to exceed 95%, while those for 12-inch WLP at TSMC's facilities at the Southern Taiwan Science Park (STSP) stay between 70% and 80%, the sources revealed.

Fingerprint sensors for Apple's iPhone 5s have been manufactured at TSMC's 8-inch fabs. Produciton of the sensors once suffered unsatisfactory yield rates limiting the availability of the 5s, according to the sources.

[R-BgO]

nachdem ich letztes Jahr über Ausübungen rausgeflogen bin, heute neuer Einstieg:

Verkauf von
short-call Jan15@20$ zu 80c
short-put Jan15@15$ zu 80c
+
Kauf von entsprechender Stückzahl zur Deckung des Call zu $17,91


Ergebnis:
Eingesetztes Kapital je Kontrakt = 1.791+1.500-2*80 = 3.131$

Wenn Kurs in 2015
>20$, dann Erlös = 3.500 => Rendite 11,2%
<15$ dann halte ich 200 Stück zum Einstand von $15,65
oberhalb von 15,65 habe ich positive Rendite

[R-BgO]

TSMC mobile chip sales to grow more than 35% in 2014, says Morris Chang
Jessie Shen, DIGITIMES, Taipei [Friday 17 January 2014]


TSMC's revenues generated from the mobile device sector are expected to increase more than 35% in 2014, buoyed by the rising popularity of smartphones and tablets, and rising silicon content per device, said company chairman Morris Chang at a January 15 investors meeting.

Mobile devices that incorporate 64-bit processors and come with support for multi-mode networks will become widely available in 2014, said Chang. Meanwhile, more devices will include MEMS and NFC, feature new standards in Wi-Fi and Bluetooth, and have fingerprint recognition capabilities. The continued performance improvements and feature enhancements will boost the amount of silicon inside a system, Chang indicated.

Mobile products will be the key growth engine for TSMC in 2014, when the company expects to post double-digit revenue growth, Chang noted. In terms of technology, TSMC's 20nm SoC and 28nm HKMG process nodes will fuel the company's growth in 2014, Chang said.

Also at the investors meeting, TSMC co-CEO CC Wei disclosed that shipments of 20nm process technology will reach about 10% of the company's total wafer sales in 2014. The foundry has moved the node to volume production in the first quarter.

As for TSMC's 16nm FinFET process, the node will be ready for mass production in 2015, company co-CEO Mark Liu indicated.

[R-BgO]

Ergebnisse 2013 kamen am Do;

ein Kommentar dazu: http://www.fool.com/investing/general/2014/01/17/taiwan-semi…

[R-BgO]

TSMC board approves US$3 billion for advanced process capacity expansion
Cage Chao, Taipei; Jessie Shen, DIGITIMES [Wednesday 14 November 2012]


The board of Taiwan Semiconductor Manufacturing Company (TSMC) on November 13 approved a capital appropriation in the amount of US$2.975 billion for the purpose of expanding advanced process capacity, construction of new 12-inch facilities and installation of related equipment, according to a press release from the company.

TSMC's board also agreed to allocate US$209.5 million for advanced process R&D in 2013, according to the statement.

Meanwhile, the board approved a proposal to issue up to NT$45 billion (US$1.53 billion) worth of unsecured corporate bonds in Taiwan to help finance its capacity expansion, TSMC indicated.

TSMC previously said that its capex target for 2013 will stay high at 2012 levels. TSMC estimated 2012 capex at a record US$8.3 billion.

In addition, TSMC's board also approved plans to buy NT$1.24 billion worth of new shares in its solid state lighting business unit, and NT$636 million worth of those in its solar unit, in 2013.

TSMC Solid State Lighting and TSMC Solar were both set up as TSMC's wholly-owned subsidiaries in 2011.

[R-BgO]

Q1-Zahlen waren etwas schlechter als im Vorjahr

[R-BgO]

findes es enorm, dass eine ganze Industrie zu erheblichen Teilen auf einer Firma aufbaut:

[R-BgO]

ordentliche Zahlen gestern; bin gespannt auf die Divi

[R-BgO]

TSMC to issue up to NT$35 billion bonds

Cage Chao, Taipe; Jessie Shen, DIGITIMES [Wednesday 10 August 2011]


Taiwan Semiconductor Manufacturing Company (TSMC) announced on August 9 that its board has approved the issuance of up to NT$35 billion (US$1.21 billion) in unsecured straight corporate bonds in the domestic market to secure long-term, low fixed-cost funding.

Timing and pricing of the bond sale were not disclosed.

TSMC's board also approved adjustments to the amounts of the respective business values to be transferred to the company's wholly-owned photovoltaic (PV) and LED lighting subsidiaries, TSMC said in a statement. The business spin-off was announced in April 2011, and has taken effect.

The value of the solar business to be transferred to TSMC Solar is determined to be NT$11.18 billion, and that of the solid state lighting business to be transferred to TSMC Solid State Lighting is determined to be NT$2.27 billion, according to TSMC.

TSMC shares closed at NT$63.30 on the Taiwan Stock Exchange (TSE) on August 9, down NT$1.90.