Toyo Tire selects HPE GreenLake cloud to accelerate HPC-powered digitized development of next-generation tires

Hewlett Packard Enterprise (NYSE: HPE) today announced that Toyo Tire Corporation selected HPE to deliver its seventh generation high performance computing (HPC) system, which is three times more powerful than its predecessor, as a-service through HPE GreenLake cloud. The upgraded system and boosted performance accelerate time-to-market for next-generation tires by processing structural tire data quickly and with greater precision. The expanded computational power significantly reduces the time required for complex and parameter-rich large-scale design simulations that Toyo Tire utilizes to train its AI models.

“Toyo Tire continues to demonstrate innovation in tire engineering and development using high performance computing,” said Hirokazu Mochizuki, senior vice president and managing director for HPE Japan. “We are pleased to collaborate with Toyo Tire and strengthen its digitized development with powerful HPE Cray performance delivered via HPE GreenLake cloud. The latest solution provides Toyo Tire an optimal level of performance, in a flexible environment, to support a new era of innovation, with speed and efficiency.”

The latest advancements allow Toyo Tire to stay ahead of market needs to innovate new generations of tires that address global trends, including transitions to electric vehicles (EVs) and overall improvement to performance and features to minimize environmental impact across fuel consumption, noise levels, wear resistance and load-bearing capacity.

“As the automotive industry accelerates its digital transformation and increasingly moves towards simulation instead of prototyping and performance evaluation testing, automakers are increasingly requesting mathematical models of tires which is a faster, more cost efficient and sustainable process,” said Tamotsu Mizutani, Corporate Officer and Division General Manager, Technology Development Division of Toyo Tire. “This requires numerical models of the tire and our new HPC system will advance this move towards digitized simulation. Our design engineers are excited about the enhanced capabilities of the system, and we are looking forward to accelerating the training of our AI models.”