ACM Research Expands Advanced Packaging Portfolio with Introduction of Frame Wafer Cleaning Tool

Achieves residue-free performance for post-debonding cleaning while minimizing environmental impact

FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today introduced its Frame Wafer Cleaning Tool for advanced packaging. The tool effectively cleans semiconductor wafers during the post-debonding cleaning process. The Frame Wafer Cleaning Tool also includes an innovative solvent reclamation system that provides environmental and cost benefits. This feature enables nearly 100% recovery and filtration of the solvents, thus reducing the use of consumables used during the production process. ACM also announced today that it has successfully completed the installation and qualification of the first tool with a major Chinese manufacturer.

“We believe ACM’s industry experience and customer relationships position us to support the evolving demands of advanced packaging,” said ACM President and Chief Executive Officer Dr. David Wang. “We believe our Frame Wafer Cleaning Tool will prove attractive to our customer base as the semiconductor industry shifts to advanced packaging and 3D integration for back-end designs. We are committed to addressing sustainability demands by offering our customers with tools that can recover solvents, thereby reducing waste and lowering the total cost of ownership in the production process.”

The tool seamlessly handles standard wafers and tape frame wafers. The chambers and load port are configured to accommodate simultaneous processing of both types of wafers, providing flexible and efficient operational capabilities. ACM’s proprietary handling allows the tool to process thin wafers with thicknesses above 150µm. The cleaning process utilizes ACM’s patented Smart Megasonix technology for thorough, damage-free cleaning across the wafer. It provides photoresist residue removal, particularly edge bead removal, leaving a residue-free surface post-cleaning.

Key features of the Frame Wafer Cleaning Tool include:

• A specially engineered vacuum chuck that ensures minimal backside damage to wafers, setting a new standard for precision in extreme cleaning conditions.
• Use of ACM’s patented fixed method, which guarantees unparalleled stability for tape-frame processing during high-speed rotation.
• State-of-the-art anti-static performance using an ion bar in the equipment front-end module and each chamber module, complemented by a DI-CO2 mixer, to safeguard wafers against static electricity impact throughout the processing cycle.